books search
books
articles search
articles
Donate
Log In
Log In
to access more features
personal recommendations
Telegram Bot
download history
send to Email or Kindle
manage booklists
save to favorites
Explore
Journals
Contribution
Donate
Litera Library
Donate paper books
Add paper books
Open LITERA Point
Volume 33; Issue 1-4
Main
Microelectronic Engineering
Volume 33; Issue 1-4
Microelectronic Engineering
Volume 33; Issue 1-4
1
Preface
T. Gessner
,
J. Torres
,
G. Crean
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 47 KB
Your tags:
english, 1997
2
Cu-CVD process optimised in a cluster equipment for IC manufacturing
C. Marcadal
,
E. Richard
,
J.L. Mermet
,
J. Torres
,
J. Palleau
,
B. Alaux
,
M. Bakli
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 495 KB
Your tags:
english, 1997
3
Selective metallization of silica surfaces by copper CVD using a chemical affinity pattern created by gas phase silylation and UV exposure
Pascal Doppelt
,
Martin Stelzle
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 479 KB
Your tags:
english, 1997
4
Copper LPCVD for advanced technology
N. Bourhila
,
J. Torres
,
J. Palleau
,
C. Bernard
,
R. Madar
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 335 KB
Your tags:
english, 1997
5
Gap filling with PVD processes for copper metallized integrated circuits
Christian Wenzel
,
Norbert Urbansky
,
Wolfgang Klimes
,
Peter Siemroth
,
Thomas Schülke
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 459 KB
Your tags:
english, 1997
6
Mechanical reliability of CVD-copper thin films
J.F. Jongste
,
J.P. Lokker
,
G.C.A.M. Janssen
,
S. Radelaar
,
J. Torres
,
J. Palleau
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 445 KB
Your tags:
english, 1997
7
Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization
Yosi Shacham-Diamand
,
Valery M. Dubin
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 711 KB
Your tags:
english, 1997
8
Electroless and electro-plating of Cu on Si
S.G. dos Santos F
,
L.F.O. Martins
,
P.C.T. D'Ajello
,
A.A. Pasa
,
C.M. Hasenack
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 350 KB
Your tags:
english, 1997
9
Selective electroless copper metallization on a titanium nitride barrier layer
J.C. Patterson
,
M. O'Reilly
,
G.M. Crean
,
J. Barrett
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 471 KB
Your tags:
english, 1997
10
Electromigration resistance of copper interconnects
D. Save
,
F. Braud
,
J. Torres
,
F. Binder
,
C. Müller
,
J.O. Weidner
,
W. Hasse
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 483 KB
Your tags:
english, 1997
11
Approaches for patterning of aluminum
Wolfgan E. Frank
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 919 KB
Your tags:
english, 1997
12
CVD AL for advanced interconnect applications
Karl A. Littau
,
Rod Mosely
,
Steve Zhou
,
Hong Zhang
,
Ted Guo
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 768 KB
Your tags:
english, 1997
13
Enhanced reliability of W-encapsulated AlSi-interconnections using selective W-CVD
S.E. Schulz
,
J.-O. Weidner
,
W. Hasse
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 387 KB
Your tags:
english, 1997
14
Effect of tungsten chemical vapor deposition nucleation step on via performance
L. Ulmer
,
L. Georges
,
J.C. Veler
,
Y. Morand
,
M. Bakli
,
V. Ferrier
,
M. Lerme
,
L. Perroud
,
T. Morel
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 356 KB
Your tags:
english, 1997
15
Mechanical behaviour during thermal cycling of AlVPd line patterns
J.P. Lokker
,
A.J. Kalkman
,
H. Schellevis
,
G.C.A.M. Janssen
,
S. Radelaar
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 415 KB
Your tags:
english, 1997
16
Stress relaxation in Al(Cu) thin films
J. Proost
,
A. Witvrouw
,
P. Cosemans
,
Ph. Roussel
,
K. Maex
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 529 KB
Your tags:
english, 1997
17
A mechanism for electroless Cu plating onto Si
Sebastião G. dos Santos Filho
,
AndréA. Pasa
,
Claus M. Hasenack
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 363 KB
Your tags:
english, 1997
18
Copper metallized test structure
Norbert Urbansky
,
Dietrich Burmeister
,
Christian Wenzel
,
Konrad Melzer
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 318 KB
Your tags:
english, 1997
19
Electrical properties of copper films produced by MOCVD
Stephan Riedel
,
Jürgen Röber
,
Thomas Geßner
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 397 KB
Your tags:
english, 1997
20
Materials and processing for 0.25 μm multilevel interconnect
Mouloud Bakli
,
Laurence Baud
,
Hichem M'Saad
,
Didier Pique
,
Patrick Rabinzohn
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 802 KB
Your tags:
english, 1997
21
Study on titanium salicide process for thin-film SOI devices
Jian Chen
,
Jean-Pierre Colinge
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 321 KB
Your tags:
english, 1997
22
Wet cleanings adapted to backend processes
F. Tardif
,
J. Palleau
,
T. Lardin
,
O. Demolliens
,
A. Vincent
,
J. Torres
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 376 KB
Your tags:
english, 1997
23
Halogen based copper RIE—influence of the material characteristics and deposition processes
Andreas Bertz
,
Matthias Markert
,
Thomas Gessner
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 618 KB
Your tags:
english, 1997
24
Copper contamination effects in 0.5 μm BiCMOS technology
T. Gravier
,
F. Braud
,
J. Torres
,
J. Palleau
,
A. Chantre
,
J. Kirtsch
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 241 KB
Your tags:
english, 1997
25
Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices
D. Popovici
,
J.E. Klemberg-Sapieha
,
G. Czeremuszkin
,
E. Sacher
,
M. Meunier
,
L. Martinu
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 261 KB
Your tags:
english, 1997
26
Passivation role of sulfur and etching behavior in plasma etched TiW using SF6 and BCl3 gases
Il-Sup Jin
,
Hyung-Ho Park
,
Kwang-Ho Kwon
,
Chang-Il Kim
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 356 KB
Your tags:
english, 1997
27
W-CMP for sub-micron inverse metallisation
Herma van Kranenburg
,
Herman D. van Corbach
,
Pierre H. Woerlee
,
Martin Lohmeier
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 429 KB
Your tags:
english, 1997
28
Chemical-mechanical polishing of copper for interconnect formation
Z. Stavreva
,
D. Zeidler
,
M. Plötner
,
G. Grasshoff
,
K. Drescher
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 569 KB
Your tags:
english, 1997
29
Statistical metrology for characterizing CMP processes
Sharad Prasad
,
W. Loh
,
A. Kapoor
,
E. Chang
,
B. Stine
,
D. Boning
,
J. Chung
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 385 KB
Your tags:
english, 1997
30
Characterization of Cu chemical mechanical polishing by electrochemical investigations
D. Zeidler
,
Z. Stavreva
,
M. Plötner
,
K. Drescher
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 361 KB
Your tags:
english, 1997
31
Study of nanocrystalline Ta(N,O) diffusion barriers for use in Cu metallization
Momtchil Stavrev
,
Dirk Fischer
,
Andrea Preuß
,
Christian Wenzel
,
Norbert Mattern
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 367 KB
Your tags:
english, 1997
32
Plasma CVD of high quality titanium nitride using titanium(IV)isopropoxide as precursor
A. Weber
,
R. Poeckelmann
,
C.-P. Klages
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 336 KB
Your tags:
english, 1997
33
Investigation of copper metallization induced failure of diode structures with and without a barrier layer
J. Baumann
,
Ch. Kaufmann
,
M. Rennau
,
Th. Werner
,
T. Gessner
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 2.14 MB
Your tags:
english, 1997
34
Ultra thin diffusion barriers for Cu interconnections at the gigabit generation and beyond
F. Braud
,
J. Torres
,
J. Palleeau
,
J.L. Mermet
,
C. Marcadal
,
E. Richard
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 410 KB
Your tags:
english, 1997
35
Electrical characterization of Cu-diffusion barriers using Schottky diodes
C. Ahrens
,
G. Friese
,
R. Ferretti
,
B. Schwierzi
,
W. Hasse
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 380 KB
Your tags:
english, 1997
36
In-situ and real time room temperature oxidation studies of fcc TiN thin films
S. Logothetidis
,
A. Barborica
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 459 KB
Your tags:
english, 1997
37
Titanium silicide formation in bilayer barrier structure
G. Sade
,
J. Pelleg
,
V. Ezersky
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 400 KB
Your tags:
english, 1997
38
Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material
Michael E. Mills
,
Paul Townsend
,
Dan Castillo
,
Steve Martin
,
Albert Achen
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 468 KB
Your tags:
english, 1997
39
Study of fluorine stability in fluoro-silicate glass and effects on dielectric properties
Gérard Passemard
,
Pascal Fugier
,
Patrice Noel
,
Fabrice Pires
,
Olivier Demolliens
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 398 KB
Your tags:
english, 1997
40
Evaluation of SiO2 aerogel thin film with ultra low dielectric constant as an intermetal dielectric
Moon-Ho Jo
,
Jung-Kyun Hong
,
Hyung-Ho Park
,
Joong-Jung Kim
,
Sang-Hun Hyun
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 316 KB
Your tags:
english, 1997
41
PECVD of silicon oxynitride for copper metallization systems
M. Vogt
,
M. Kachel
,
K. Melzer
,
K. Drescher
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 434 KB
Your tags:
english, 1997
42
Monitoring of the thermal annealing of HDP-Si oxides by positron annihilation and thermal desorption spectrometry
H. Schut
,
A. van Veen
,
L.V. Jørgensen
,
O. Dankert
,
K.T. Westerduin
,
A.H. Reader
,
J.C. Oberlin
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 319 KB
Your tags:
english, 1997
43
Optical characterisation of thin film benzocyclobutene (BCB) based polymers
J.T. Beechinor
,
E. McGlynn
,
M. O'Reilly
,
G.M. Crean
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 306 KB
Your tags:
english, 1997
44
Study of the thermal stability at the interface
A. Labiadh
,
F. Braud
,
J. Torres
,
J. Palleau
,
G. Passemard
,
F. Pires
,
J.C. Dupuy
,
C. Dubois
,
B. Gautier
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 291 KB
Your tags:
english, 1997
45
Dielectric properties of PET below its glass transition temperature
Tatiana Pop
,
D. Iordache
,
A. Jonas
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 456 KB
Your tags:
english, 1997
46
Dielectric characterization of some low permittivity polymers by thermally stimulated depolarization current method
Tatiana Pop
,
I. Pop
,
Doinita Ionescu
,
R. Ispasoiu
,
Sanda Cotescu
,
Maria Marza
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 430 KB
Your tags:
english, 1997
47
3D simulation for sub-micron metallization
E. Bär
,
J. Lorenz
,
H. Ryssel
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 525 KB
Your tags:
english, 1997
48
Interconnect parasitics evaluation and optimization
N. Delorme
,
M. Belleville
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 553 KB
Your tags:
english, 1997
49
Delay simulation comparisons between and multilevel interconnect
L. Floyd
,
M. O'Reilly
,
A. Mathewson
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 409 KB
Your tags:
english, 1997
50
Native oxide structure investigation by molecular simulation
A. Tandia
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 328 KB
Your tags:
english, 1997
51
Geometrical optimization of multilevel interconnects using Cu and low-k dielectrics
R. Streiter
,
T. Geßner
,
H. Wolf
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 403 KB
Your tags:
english, 1997
52
Thermodynamics of ordering in metastable TiSi(B32) phase
David Fuks
,
Simon Dorfman
,
Genady Davidov
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 345 KB
Your tags:
english, 1997
53
Author index volume 33
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 332 KB
Your tags:
english, 1997
54
Editorial Board
Journal:
Microelectronic Engineering
Year:
1997
Language:
english
File:
PDF, 64 KB
Your tags:
english, 1997
55
Organizing committee
Journal:
Microelectronic Engineering
Year:
1997
File:
PDF, 13 KB
Your tags:
1997
1
Follow
this link
or find "@BotFather" bot on Telegram
2
Send /newbot command
3
Specify a name for your chatbot
4
Choose a username for the bot
5
Copy an entire last message from BotFather and paste it here
×
×