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Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices
D. Popovici, J.E. Klemberg-Sapieha, G. Czeremuszkin, E. Sacher, M. Meunier, L. MartinuVolume:
33
Year:
1997
Language:
english
Pages:
5
DOI:
10.1016/s0167-9317(96)00048-2
File:
PDF, 261 KB
english, 1997