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Investigation of copper metallization induced failure of diode structures with and without a barrier layer
J. Baumann, Ch. Kaufmann, M. Rennau, Th. Werner, T. GessnerVolume:
33
Year:
1997
Language:
english
Pages:
9
DOI:
10.1016/s0167-9317(96)00056-1
File:
PDF, 2.14 MB
english, 1997