A pad roughness model for the analysis of lubrication in the chemical mechanical polishing of a silicon wafer
Guo, Dongming, Liu, Jingyuan, Kang, Renke, Jin, ZhujiVolume:
22
Language:
english
Journal:
Semiconductor Science and Technology
DOI:
10.1088/0268-1242/22/7/020
Date:
July, 2007
File:
PDF, 139 KB
english, 2007