Low-cost post-CMOS integration of electroplated microstructures for inertial sensing
M. Wycisk, T. Tönnesen, J. Binder, S. Michaelis, H.-J. TimmeVolume:
83
Year:
2000
Language:
english
Pages:
8
DOI:
10.1016/s0924-4247(00)00295-8
File:
PDF, 2.39 MB
english, 2000