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Wafer bonding for microsystems technologies
U. Gösele, Q.-Y. Tong, A. Schumacher, G. Kräuter, M. Reiche, A. Plößl, P. Kopperschmidt, T.-H. Lee, W.-J. KimVolume:
74
Year:
1999
Language:
english
Pages:
8
DOI:
10.1016/s0924-4247(98)00310-0
File:
PDF, 492 KB
english, 1999