Novel Hybrid Bonding Technology Using Ultra-High Density Cu...

IEEE Electron Device Letters 2016 / 1 Vol. 37; Iss. 1

Novel Hybrid Bonding Technology Using Ultra-High Density Cu Nano-Pillar for Exascale 2.5D/3D Integration

Lee, Kangwook, Bea, Jichel, Fukushima, Takafumi, Ramalingam, Suresh, Wu, Xin, Tanaka, Tetsu, Koyanagi, Mitsumasa
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Volume:
37
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2015.2502584
Date:
January, 2016
File:
PDF, 726 KB
english, 2016
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