The Effects of Multiple Zincation Process on Aluminum Bond...

Journal of Electronic Packaging 2006 Vol. 128; Iss. 3

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

Md Arshad, M. K., Ahmad, I., Jalar, A., Omar, G., Hashim, U.
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Volume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2229223
File:
PDF, 601 KB
english, 2006
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