Volume 128; Issue 3

Journal of Electronic Packaging

Volume 128; Issue 3
2

An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing

Year:
2006
Language:
english
File:
PDF, 3.54 MB
english, 2006
4

Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling

Year:
2006
Language:
english
File:
PDF, 1.55 MB
english, 2006
11

Reliability of Lead-Free Solder Joints

Year:
2006
Language:
english
File:
PDF, 348 KB
english, 2006