A Numerical Model to Predict the Thermal and Psychrometric...

Journal of Electronic Packaging 2001 Vol. 123; Iss. 3

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

Vargas, J. V. C., Stanescu, G., Florea, R., Campos, M. C.
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Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1348337
File:
PDF, 747 KB
english, 2001
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