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Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
Liu, C. J., Ernst, L. J., Wisse, G., Zhang, G. Q., Vervoort, M.Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1604152
File:
PDF, 1.49 MB
english, 2003