Volume 125; Issue 4

Journal of Electronic Packaging

Volume 125; Issue 4

1

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

Ernst, L. J., Zhang, G. Q., Jansen, K. M. B., Bressers, H. J. L.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 606 KB

english, 2003

2

Four-Terminal Measurement and Simulations for Sheet Resistance in Piezoresistive Sensing Elements

Chen, Steven, Chiou, J. Albert

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 370 KB

english, 2003

3

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

Puigcorbé, J., Marco, S., Leseduarte, S., Carmona, M., Vendier, O., Devron, C., Delage, S. L., Floriot, D., Blanck, H.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 428 KB

english, 2003

4

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Vandevelde, Bart, Beyne, Eric, Zhang, Kouchi (G.Q.), Caers, Jo, Vandepitte, Dirk, Baelmans, Martine

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.11 MB

english, 2003

5

Three- and Four-Point Bend Testing for Electronic Packages

Shetty, Santosh, Reinikainen, Tommi

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 402 KB

english, 2003

6

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

Wei, Tan Chee, Daud, Abdul Razak

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 199 KB

english, 2003

7

Response Surface Modeling for Nonlinear Packaging Stresses

van Driel, W. D., Zhang, G. Q., Janssen, J. H. J., Ernst, L. J.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 356 KB

english, 2003

8

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

den Toonder, Jaap M. J., Rademaker, Christian W., Hu, Ching-Li

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 169 KB

english, 2003

9

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

Liu, C. J., Ernst, L. J., Wisse, G., Zhang, G. Q., Vervoort, M.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.49 MB

english, 2003

10

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

Lau, John H., Pan, Stephen H.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.17 MB

english, 2003

11

A Vapotron Effect Application for Electronic Equipment Cooling

Lorenzini, Giulio, Biserni, Cesare

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 307 KB

english, 2003

12

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Ernst, L. J., Zhang, G. Q.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 27 KB

english, 2003

13

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

Carmona, M., Marco, S., Samitier, J., Acero, M. C., Plaza, J. A., Esteve, J.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 332 KB

english, 2003

14

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

Lau, John H., Erasmus, Steve, Zou, Yida

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 349 KB

english, 2003

15

Characterization of Lead-Free Solders in Flip Chip Joints

Wiese, S., Meusel, E.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.00 MB

english, 2003

16

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

Tay, A. A. O., Lee, K. H., Lim, K. M.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 162 KB

english, 2003

17

Reliability Prediction of Area Array Solder Joints

Dudek, Rainer, Döring, Ralf, Michel, Bernd

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 317 KB

english, 2003

18

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

Dou, G. B., Chan, Y. C., Liu, Johan

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 892 KB

english, 2003

19

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

van Driel, W. D., Janssen, J. H. J., Zhang, G. Q., Yang, D. G., Ernst, L. J.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 661 KB

english, 2003

20

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

Cole, Reena, Davies, Mark, Punch, Jeff

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 466 KB

english, 2003

21

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

Yuan, Chang-An, Chiang, Kou-Ning

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 450 KB

english, 2003

22

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

Zhao, X. J., Zhang, G. Q., Caers, J. F. J. M., Ernst, L. J.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.07 MB

english, 2003

23

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

Chiou, J. Albert, Chen, Steven, Jiao, Jinbao

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 938 KB

english, 2003

24

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Chiriac, Victor Adrian, Lee, Tien-Yu Tom

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.01 MB

english, 2003

25

Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects

Lee, R. T. P., Zuruzi, A. S., Lahiri, S. K.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.03 MB

english, 2003

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