Effects of Wafer Thinning Condition on the Roughness,...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 1

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

McLellan, Neil, Fan, Nelson, Liu, Shilai, Lau, Kim, Wu, Jingshen
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Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1647123
File:
PDF, 244 KB
english, 2004
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