Volume 126; Issue 1

Journal of Electronic Packaging

Volume 126; Issue 1
1

Engineering of Superconductive Ceramics

Year:
2004
Language:
english
File:
PDF, 575 KB
english, 2004
4

A Hybrid Thermal Energy Storage Device, Part 1: Design Methodology

Year:
2004
Language:
english
File:
PDF, 477 KB
english, 2004
10

Why Gold Flash Can Be Detrimental to Long-Term Reliability

Year:
2004
Language:
english
File:
PDF, 262 KB
english, 2004
11

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

Year:
2004
Language:
english
File:
PDF, 417 KB
english, 2004
15

Failure Analysis of Miniature Solder Specimen

Year:
2004
Language:
english
File:
PDF, 261 KB
english, 2004
17

Air Flow and Heat Transfer in Fan Cooled Electronic Systems

Year:
2004
Language:
english
File:
PDF, 661 KB
english, 2004
20

Investigation of Flip-Chip Bonding for MEMS Applications

Year:
2004
Language:
english
File:
PDF, 214 KB
english, 2004
23

Interfacial Bond Stress Relationship for Gullwing Solder Joints

Year:
2004
Language:
english
File:
PDF, 153 KB
english, 2004
24

The Moulded Electronic Package (MEP)

Year:
2004
Language:
english
File:
PDF, 240 KB
english, 2004
26

Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces

Year:
2004
Language:
english
File:
PDF, 508 KB
english, 2004
27

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

Year:
2004
Language:
english
File:
PDF, 151 KB
english, 2004