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A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly
Tsai, M. Y., Hsu, C. H., Han, C. N.Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1648056
File:
PDF, 284 KB
english, 2004