A Damage-Mechanics-Based Constitutive Model for Solder...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 3

A Damage-Mechanics-Based Constitutive Model for Solder Joints

Basaran, C., Zhao, Y., Tang, H., Gomez, J.
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1939822
File:
PDF, 526 KB
english, 2005
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