Volume 127; Issue 3

Journal of Electronic Packaging

Volume 127; Issue 3

1

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Ahmad, Mudasir, Hubbard, Ken, Hu, Mason

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.28 MB

english, 2005

2

Effects of Two-Dimensional Roughness in Flow in Microchannels

Wang, Xiang-Qi, Yap, Christopher, Mujumdar, Arun Sadashiv

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 162 KB

english, 2005

3

Interfacial Thermal Stresses in Trilayer Assemblies

Ghorbani, H. R., Spelt, J. K.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 265 KB

english, 2005

4

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

Bhowmik, H., Tou, K. W.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 178 KB

english, 2005

5

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Jeng, Tzer-Ming, Liu, Li-Kang, Hung, Ying-Huei

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.02 MB

english, 2005

6

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Fan, X. J., Zhou, J., Zhang, G. Q., Ernst, L. J.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 307 KB

english, 2005

7

A Damage-Mechanics-Based Constitutive Model for Solder Joints

Basaran, C., Zhao, Y., Tang, H., Gomez, J.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 526 KB

english, 2005

8

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Aravamudhan, Srinivasa, Santos, Daryl, Pham-Van-Diep, Gerald, Andres, Frank

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.39 MB

english, 2005

9

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

Bhowmik, H., Tso, C. P., Tou, K. W.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 372 KB

english, 2005

10

Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

Park, Jong-Jin, Taya, Minoru

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 504 KB

english, 2005

11

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Park, Tae-Sang, Lee, Soon-Bok

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 793 KB

english, 2005

12

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Xu, Jun, Wirtz, Richard A.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 159 KB

english, 2005

13

Dynamics of Board-Level Drop Impact

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 475 KB

english, 2005

14

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

den Toonder, J. M. J., Ramone, Y., van Dijken, A. R., Beijer, J. G. J., Zhang, G. Q.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 982 KB

english, 2005

15

Effect of Stress on the Dielectric Constant of Alumina

Wen, Sihai, Chung, D. D. L.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 73 KB

english, 2005

16

Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

Pei, Chien-Chang, Hwang, Sheng-Jye

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 578 KB

english, 2005

17

Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

Tay, Andrew A. O.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 844 KB

english, 2005

18

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

Geers, M. G. D., Kouznetsova, V., Brekelmans, W. A. M.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 581 KB

english, 2005

19

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Ting, Ben, Manno, Vincent P.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 288 KB

english, 2005

20

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hadim, Hamid, Suwa, Tohru

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 593 KB

english, 2005

21

Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection

Eveloy, Valérie, Rodgers, Peter, Hashmi, M. S. J.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 768 KB

english, 2005

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