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Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
Bhattacharya, A., Mahajan, R. L.Volume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2229225
File:
PDF, 550 KB
english, 2006