Laminar Heat Transfer in Constructal Microchannel Networks...

Journal of Electronic Packaging 2006 Vol. 128; Iss. 3

Laminar Heat Transfer in Constructal Microchannel Networks With Loops

Wang, Xiang-Qi, Yap, Christopher, Mujumdar, Arun S.
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Volume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2229228
File:
PDF, 928 KB
english, 2006
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