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A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment
Rayasam, Mahidhar, Subbarayan, GaneshVolume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2229232
File:
PDF, 74 KB
english, 2006