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Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique
Akay, H. U., Paydar, N. H., Bilgic, A.Volume:
119
Year:
1997
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792241
File:
PDF, 746 KB
english, 1997