Volume 119; Issue 4

Journal of Electronic Packaging

Volume 119; Issue 4
1

Transient Response of Microchannel Heat Sinks in a Silicon Wafer

Year:
1997
Language:
english
File:
PDF, 791 KB
english, 1997
9

Development of a Two Matrix Model for Thermal Analysis of a Multichip Module

Year:
1997
Language:
english
File:
PDF, 617 KB
english, 1997
10

Z-Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

Year:
1997
Language:
english
File:
PDF, 918 KB
english, 1997