Improved Analytical Estimate of Global CTE Mismatch...

Journal of Electronic Packaging 1997 Vol. 119; Iss. 4

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

Heinrich, S. M., Shakya, S., Lee, P. S.
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Volume:
119
Year:
1997
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792240
File:
PDF, 901 KB
english, 1997
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