Thermomechanical Behavior of Multilayer Structures in...

Journal of Electronic Packaging 1990 Vol. 112; Iss. 1

Thermomechanical Behavior of Multilayer Structures in Microelectronics

Daniel, I. M., Wang, T.-M., Gotro, J. T.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904332
File:
PDF, 924 KB
english, 1990
Conversion to is in progress
Conversion to is failed