Volume 112; Issue 1

Journal of Electronic Packaging

Volume 112; Issue 1
1

Modeling Thermal Stress Behavior in Microelectronic Components

Year:
1990
Language:
english
File:
PDF, 603 KB
english, 1990
2

Thermal Stresses in Compliantly Joined Materials

Year:
1990
Language:
english
File:
PDF, 652 KB
english, 1990
3

Deformation in Multilayer Stacked Assemblies

Year:
1990
Language:
english
File:
PDF, 449 KB
english, 1990
6

Realistic Modeling of Edge Effect Stresses in Bimaterial Elements

Year:
1990
Language:
english
File:
PDF, 614 KB
english, 1990
7

Structural Analysis For Circuit Card Systems Subjected to Bending

Year:
1990
Language:
english
File:
PDF, 777 KB
english, 1990
8

Mechanical Evaluation of the “Euler” Test Probe

Year:
1990
Language:
english
File:
PDF, 413 KB
english, 1990
9

How Long Should Be a Beam Specimen in Bending Tests?

Year:
1990
Language:
english
File:
PDF, 222 KB
english, 1990
11

Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation

Year:
1990
Language:
english
File:
PDF, 765 KB
english, 1990