Effect of reflow profile on wetting and intermetallic...

Soldering & Surface Mount Technology 2002 / 08 Vol. 14; Iss. 2

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, Lepistö, Toivo
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
14
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910210427781
Date:
August, 2002
File:
PDF, 576 KB
english, 2002
Conversion to is in progress
Conversion to is failed