Volume 14; Issue 2

Soldering & Surface Mount Technology

Volume 14; Issue 2

1

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Arra, Minna, Shangguan, Dongkai, Ristolainen, Eero, Lepistö, Toivo

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 576 KB

english, 2002

2

Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging

Lawrence Wu, C.M., Chau, M.L.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 735 KB

english, 2002

3

Intermetallic morphology around Ni particles in Sn‐3.5Ag solder

Lee, J.G., Guo, F., Subramanian, K.N., Lucas, J.P.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 863 KB

english, 2002

4

Reliability of tin‐lead balled BGAs soldered with lead‐free solder paste

Tapani Nurmi, Sami, Olavi Ristolainen, Eero

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 377 KB

english, 2002

5

A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects

Vianco, P.T., Rejent, J.A.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 971 KB

english, 2002

6

Solder ball failure mechanisms in plastic ball grid array packages

Zhong, C.H., Yi, S., Whalley, D.C.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 1.66 MB

english, 2002