Yield Prediction Through the Event Sequence Analysis of the...

IEEE Transactions on Semiconductor Manufacturing 2015 / 11 Vol. 28; Iss. 4

Yield Prediction Through the Event Sequence Analysis of the Die Attach Process

Lee, Hoyeop, Kim, Chang Ouk, Ko, Hyo Heon, Kim, Min-Kyoon
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2015.2487540
Date:
November, 2015
File:
PDF, 1.39 MB
english, 2015
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