Improved surface morphology of a Ti/Al/Ni/Au ohmic contact...

Microelectronics Reliability 2015 / 12 Vol. 55; Iss. 12

Improved surface morphology of a Ti/Al/Ni/Au ohmic contact for AlGaN/GaN heterostructure by Al2O3 particles

Lim, Jin Hong, Kim, Jeong Jin, Yang, Jeon Wook
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Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.10.005
Date:
December, 2015
File:
PDF, 900 KB
english, 2015
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