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Volume 55; Issue 12
Main
Microelectronics Reliability
Volume 55; Issue 12
Microelectronics Reliability
Volume 55; Issue 12
1
Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density
Kadoguchi, Takuya
,
Gotou, Keisuke
,
Yamanaka, Kimihiro
,
Nagao, Shijo
,
Suganuma, Katsuaki
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.43 MB
Your tags:
english, 2015
2
Study on reliability of PQFP assembly with lead free solder joints under random vibration test
Che, F.X.
,
Pang, John H.L.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.81 MB
Your tags:
english, 2015
3
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
Zhao, Su-Yan
,
Li, Xin
,
Mei, Yun-Hui
,
Lu, Guo-Quan
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 3.63 MB
Your tags:
english, 2015
4
Adding a self-reset feature to the Bulk-BICS with dynamic storage cell
Simionovski, Alexandre
,
Wirth, Gilson
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 625 KB
Your tags:
english, 2015
5
Inverse Gaussian distribution based timing analysis of Sub-threshold CMOS circuits
Chen, Jiaoyan
,
Cotofana, Sorin
,
Grandhi, Satish
,
Spagnol, Christian
,
Popovici, Emanuel
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.29 MB
Your tags:
english, 2015
6
Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability
Chenniki, Walide
,
Bord-Majek, Isabelle
,
Louarn, Mélanie
,
Gaud, Vincent
,
Diot, Jean-Luc
,
Wongtimnoi, Komkrisd
,
Ousten, Yves
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 725 KB
Your tags:
english, 2015
7
Study of Al−Cu compounds as soldering bond pad for high-power device packaging
Liu, Wei Chih
,
Chen, Yan Hao
,
Chung, Te Yuan
,
Liu, Cheng Yi
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.47 MB
Your tags:
english, 2015
8
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions
Yan, Haidong
,
Mei, Yunhui
,
Li, Xin
,
Zhang, Pu
,
Lu, Guo-Quan
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 2.55 MB
Your tags:
english, 2015
9
Scaling DC lifetests on GaN HEMT to RF conditions
Paine, Bruce M.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 891 KB
Your tags:
english, 2015
10
Temperature, humidity, and bias acceleration model for a GaAs pHEMT process
Drandova, Gergana I.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.22 MB
Your tags:
english, 2015
11
Dynamic compact thermal model of high power light emitting diode
Lai, Wei
,
Liu, Xianming
,
Chen, Weimin
,
Lei, Xiaohua
,
Cao, Xueying
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.29 MB
Your tags:
english, 2015
12
Improved surface morphology of a Ti/Al/Ni/Au ohmic contact for AlGaN/GaN heterostructure by Al2O3 particles
Lim, Jin Hong
,
Kim, Jeong Jin
,
Yang, Jeon Wook
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 900 KB
Your tags:
english, 2015
13
Power electronics packaging
Suganuma, Katsuaki
,
Song, Jenn-Ming
,
Lai, Yi-Shao
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 130 KB
Your tags:
english, 2015
14
The surface energies of β-Sn — A new concept for corrosion and whisker mitigation
Eckold, P.
,
Sellers, M.S.
,
Niewa, R.
,
Hügel, W.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 2.02 MB
Your tags:
english, 2015
15
Study of hot electrons in AlGaN/GaN HEMTs under RF Class B and Class J operation using electroluminescence
Brazzini, Tommaso
,
Casbon, Michael A.
,
Sun, Huarui
,
Uren, Michael J.
,
Lees, Jonathan
,
Tasker, Paul J.
,
Jung, Helmut
,
Blanck, Hervé
,
Kuball, Martin
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.25 MB
Your tags:
english, 2015
16
Editorial Board
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 70 KB
Your tags:
english, 2015
17
Editorial
Ersland, Peter
,
Menozzi, Roberto
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 129 KB
Your tags:
english, 2015
18
System efficient ESD design
Gossner, H.
,
Duvvury, C.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 895 KB
Your tags:
english, 2015
19
A novel photodiode based on Ruthenium(II) complex containing polydentate pyridine as photocatalyst
Soylu, M.
,
Orak, I.
,
Dayan, O.
,
Serbetci, Z.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 727 KB
Your tags:
english, 2015
20
Microscale temperature sensing using novel reliable silicon vertical microprobe array: Computation and experiment
Matin, M.A.
,
Ikedo, A.
,
Kawano, T.
,
Sawada, K.
,
Ishida, M.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.38 MB
Your tags:
english, 2015
21
Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
Chen, F.
,
Graas, Carole
,
Shinosky, Michael
,
Zhao, Kai
,
Narasimha, Shreesh
,
Liu, Xiao Hu
,
Tian, Chunyan
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 7.12 MB
Your tags:
english, 2015
22
Design and process related MIM cap reliability improvement
Parke, Justin
,
Lewis, Randy
,
Ha, Kathy
,
Cramer, Harlan
,
Hearne, Harold
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.34 MB
Your tags:
english, 2015
23
Using RBF networks for detection and prediction of flip chip with missing bumps
Liao, Guanglan
,
Du, Li
,
Su, Lei
,
Zeng, Miao
,
Nie, Lei
,
Shi, Tielin
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 2.28 MB
Your tags:
english, 2015
24
The tensile impact properties of aged Sn–3Ag–0.5Cu/Cu solder joints
Nguyen, Van Luong
,
Chung, Chin-Sung
,
Kim, Ho-Kyung
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 2.07 MB
Your tags:
english, 2015
25
Editorial Board
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 70 KB
Your tags:
english, 2015
26
Setting stress conditions that qualify application expectations
Roesch, William J.
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 2.24 MB
Your tags:
english, 2015
27
Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry
Lee, Chean Shen
,
Zhang, Guang-Ming
,
Harvey, David M.
,
Ma, Hong-Wei
Journal:
Microelectronics Reliability
Year:
2015
Language:
english
File:
PDF, 1.48 MB
Your tags:
english, 2015
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