Study on Ag-Plated Cu Lead Frame and Its Effect to LED...

IEEE Transactions on Device and Materials Reliability 2014 / 12 Vol. 14; Iss. 4

Study on Ag-Plated Cu Lead Frame and Its Effect to LED Performance Under Thermal Aging

Zhang, Lei, Zhu, Yejun, Wang, Wei, Bi, Xianghong, Chen, Haibin, Leung, Karina, Wu, Yeqing, Wu, Jingshen
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Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2014.2360081
Date:
December, 2014
File:
PDF, 1.98 MB
english, 2014
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