IEEE Transactions on Device and Materials Reliability

1

Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits

Xiong, Hua, Huang, Zhiheng, Conway, Paul

Journal:

Year:

2014

Language:

english

File:

PDF, 12.97 MB

english, 2014

2

Identifying PV Module Mismatch Faults by a Thermography-Based Temperature Distribution Analysis

Hu, Yihua, Cao, Wenping, Ma, Jien, Finney, Stephen J., Li, David

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.01 MB

english, 2014

3

Adaptive Technique for Overcoming Performance Degradation Due to Aging on 6T SRAM Cells

Faraji, Rasoul, Naji, Hamid Reza

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

4

An Experimental Approach to Accurate Alpha-SER Modeling and Optimization Through Design Parameters in 6T SRAM Cells for Deep-Nanometer CMOS

Torrens, Gabriel, Bota, Sebastia A., Alorda, Bartomeu, Segura, Jaume

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

5

Influence of Shunt Resistance on the Performance of an Illuminated String of Solar Cells: Theory, Simulation, and Experimental Analysis

Barbato, M., Meneghini, M., Cester, A., Mura, G., Zanoni, E., Meneghesso, G.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.05 MB

english, 2014

6

Electrical and Optical Characterization of R.F.-Sputtered CdTe Thin Films

Gorji, Nima E.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 686 KB

english, 2014

7

Calibration of a Novel Microstructural Damage Model for Wire Bonds

Yang, L., Agyakwa, P. A., Johnson, C. M.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 832 KB

english, 2014

8

Repeatability and Stability of Room-Temperature Acetone Sensor Based on $\hbox{TiO}_{2}$ Nanotubes: Influence of Stoichiometry Variation

Bhowmik, B., Hazra, A., Dutta, K., Bhattacharyya, P.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.30 MB

english, 2014

9

Interior Degradation Analysis of Distributed Feedback Laser Using Optical-Beam-Induced Current

Takeshita, T., Oda, K., Mawatari, H.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 870 KB

english, 2014

10

Reliability Study on Adhesive Interconnections in Flex-to-Flex Printed Electronics Applications Under Environmental Stresses

Happonen, Tuomas, Voutilainen, Juha-Veikko, Fabritius, Tapio

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.24 MB

english, 2014

11

Device-Level Experimental Observations of NBTI-Induced Random Timing Jitter

Jiao, G. F., Lu, J. W., Campbell, J. P., Ryan, J. T., Cheung, Kin P., Young, C. D., Bersuker, G.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 825 KB

english, 2014

12

2014 Index IEEE Transactions on Device and Materials Reliability Vol. 14

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 552 KB

english, 2014

13

Reliability Concerns Related With the Usage of Inorganic Particles in White Light-Emitting Diodes

Liu, Lilin, Tan, Xizhao, Li, Yizhou, Wu, Mingyang, Teng, Dongdong, Wang, Gang

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 548 KB

english, 2014

14

Study on Ag-Plated Cu Lead Frame and Its Effect to LED Performance Under Thermal Aging

Zhang, Lei, Zhu, Yejun, Wang, Wei, Bi, Xianghong, Chen, Haibin, Leung, Karina, Wu, Yeqing, Wu, Jingshen

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.98 MB

english, 2014

15

Investigation of Linearity in the High Electric Field Region for SiGe HBTs Based on Volterra Series

Lee, Chie-In, Lin, Yan-Ting, Lin, Wei-Cheng

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 610 KB

english, 2014

16

Failure Analysis of MIM and MIS Structures Using Point-to-Event Distance and Angular Probability Distributions

Saura Mas, Xavier, Monaghan, Scott, Hurley, Paul K., Sune, Jordi, Miranda, Enrique

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.06 MB

english, 2014

17

Improved Performance of Amorphous InGaZnO Thin-Film Transistor With $\hbox{Ta}_{2}\hbox{O}_{5}$ Gate Dielectric by Using La Incorporation

Qian, L. X., Liu, X. Z., Han, C. Y., Lai, P. T.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

File:

PDF, 744 KB

2014

18

Improved Performance of Amorphous InGaZnO Thin-Film Transistor With $\hbox{Ta}_{2}\hbox{O}_{5}$ Gate Dielectric by Using La Incorporation

Qian, L. X., Liu, X. Z., Han, C. Y., Lai, P. T.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 744 KB

english, 2014

19

In Situ ESD Protection Structure for Variable Operating Voltage Interface Applications in 28-nm CMOS Process

Luo, Sirui, Salcedo, Javier A., Parthasarathy, Srivatsan, Zhou, Yuanzhong, Hajjar, Jean-Jacques, Liou, Juin J.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

20

Study of a Permanent Shunt Across a TMR Reader With an Ultralow RA Barrier

Zheng, FuQiang, Teng, ZhaoYu, Song, ChongXi, Zhang, Yun, Chen, Chan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.21 MB

english, 2014

21

Determining Drain Current Characteristics and Channel Temperature Rise in GaN HEMTs

Zhang, Yamin, Feng, Shiwei, Zhu, Hui, Gong, Xueqin, Shi, Lei, Guo, Chunsheng

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 184 KB

english, 2014

22

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Chen, Qiao, Liu, Xi, Sundaram, Venkatesh, Sitaraman, Suresh K., Tummala, Rao R.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.00 MB

english, 2014

23