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Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging
Lawrence Wu, C.M., Chau, M.L.Volume:
14
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910210427826
Date:
August, 2002
File:
PDF, 735 KB
english, 2002