Double-Side Process and Reliability of Through-Silicon Vias...

IEEE Transactions on Device and Materials Reliability 2014 / 12 Vol. 14; Iss. 4

Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications

Chen, Qiao, Liu, Xi, Sundaram, Venkatesh, Sitaraman, Suresh K., Tummala, Rao R.
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Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2014.2361125
Date:
December, 2014
File:
PDF, 2.00 MB
english, 2014
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