Mold Compounds: Linking Material Science and IC Package...

MRS Proceedings 1995 / 1 Vol. 390

Mold Compounds: Linking Material Science and IC Package Reliability

Groothuis, Steven K., Heinen, K. Gail
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Volume:
390
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/proc-390-77
Date:
January, 1995
File:
PDF, 2.23 MB
english, 1995
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