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Volume 390

MRS Proceedings

Volume 390

1

Characterization of Films Formed during the Corrosion of Copper in Dilute Solutions of Cupric Chloride

Walsh, L. H., Feilchenfeld, N. B.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 286 KB

english, 1995

2

Corrosion Protection of Aluminum-Matrix Composites

Hou, Jiangyuan, Chung, D. D. L.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 329 KB

english, 1995

3

Improving the Electrical Conductivity of Composites Comprised of Short Conducting Fibers in a Nonconducting Matrix: The Addition of a Nonconducting Particulate Filler

Chen, Pu-Woei, Chung, D. D. L.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 396 KB

english, 1995

4

Deposition of Molten Eutectic Solder using Jet Printing Techniques

Snyder, Michael D., Lasky, Ronald

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 2.85 MB

english, 1995

5

Analysis of the Effects of Interior Aperture Angle on Print Quality in Solder Paste Stenciling

Monaghan, K., Head, L., Sahay, C., Constable, J.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 456 KB

english, 1995

6

Laser Machining and Metallization of VIAS in Aluminum Nitride

Raman, Sudhakar, Lumpp, Janet K.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 350 KB

english, 1995

7

Thin Film Polymer Stress Measurement Using Piezoresistive Anisotropically Etched Pressure Sensors

Monk, David J., Shah, Mahesh

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.71 MB

english, 1995

8

High-Performance Thermoplastics for Rigid-Flex Printed Circuit Boards

Lin, Wendy W., Savrun, Ender

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 477 KB

english, 1995

9

Corrosion Behaviour of Aluminum Metallization During Aqueous Exposure

Koo, Y. C., Walzak, T. L., Davidson, R. D.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.22 MB

english, 1995

10

Nickel Filament Polymer-Matrix Composites with Low Surface Impedance and High Electromagnetic Interference Shielding Effectiveness

Shui, Xiaoping, Chung, D. D. L.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 308 KB

english, 1995

11

High Thermal Conductivity Graphite Copper Composites with Diamond Coatings for Thermal Management Packaging Applications

Stoessel, Chris H., Pan, C., Withers, J. C., Wallace, D., Loutfy, R. O.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 2.51 MB

english, 1995

12

Mechanical Behaviour of Two Sorts of MCM Structures

Pozza, G., Parat, G., Ignat, M., Dupeux, M., Terriez, J. M.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 946 KB

english, 1995

13

Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders

Mavoori, Hareesh, Vaynman, Semyon, Chin, Jason, Moran, Brian, Keer, Leon M., Fine, Morris E.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.17 MB

english, 1995

14

Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

Liu, Tao, Korhonen, M. A., Ting, S., Kim, D., Li, C.-Y.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 854 KB

english, 1995

15

Electronics Packaging Materials Research at NIST

Schen, Michael A., Davis, G. T., Mopsik, F. I., Wu, W. L., Wallace, W. E., Manning, Jr., Handwerker, C. A., Read, D. T.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.22 MB

english, 1995

16

XPS Studies of the Interface Properties of Conductive Adhesive/Eutectic Solder

Koo, Y. C., Jennings, M. C., Davidson, R. D., McIntyre, N. S.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.03 MB

english, 1995

17

Indium-Copper Multilayer Composite Solder for Fluxless Bonding

Lee, Chin C., Chen, Yi-Chia

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 889 KB

english, 1995

18

Evaluation of No-Clean Fluxes for High Reliability Applications

Pope, E., Watson, J., Kennish, D.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 868 KB

english, 1995

19

The Use of Secondary Ion Mass Spectrometry to Investigate Wire Bonding Yield Problems on Gold Contacts

Mount, G. R., Walzak, T. L., Koo, Y. C., McClure, D.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1017 KB

english, 1995

20

Failure Analysis of Aluminum Wire Bonds in High Power Igbt Modules

Dittmer, Klaus J., Poech, Max H., Wulff, Frank W., Krumm, Martin

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 2.83 MB

english, 1995

21

Excimer Laser Direct Write Aluminum on Aluminum Nitride

Li, Hua, Lumpp, Janet K.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 2.04 MB

english, 1995

22

Adhesion of Screen Printed Conductors on Laser Reduced AlN

Gopalakrishnan, S., Lumpp, Janet K.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 742 KB

english, 1995

23

Chemical Interactions of Au and Ag Conductors in Ceramic Based Electronic Packages

Vajo, John J., Momoda, Leslie A., Harshbarger, Richard W., Elwell, Dennis F.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.14 MB

english, 1995

24

Material Science and the Electronic Packaging Roadmap

Steidel, C. A., Sundahl, R. C., Grayeli, N.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 992 KB

english, 1995

25

Thin Film Integral Capacitor Fabricated on a Polymer Dielectric for High Density Interconnect (HDI) Applications

Paik, Kyung W., Lu, Toh-Ming

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.21 MB

english, 1995

26

Stress Concentrations in Electronic Packaging

Mahajan, Ravi, Madenci, Erdogan, Ileri, Levent, Thurston, Mark

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 489 KB

english, 1995

27

Determination of the Adhesive Strength of Film-Substrate Interfaces Using the Constant Depth Scratch Test

Dutta, I., Campbell, J. C.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.98 MB

english, 1995

28

Adhesion Strength of CuCr Alloy Films to Polyimide

Ahn, E. C., Yu, Jin, Park, I. S.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.79 MB

english, 1995

29

Advances in Liquid Encapsulated Chip-on-Board / MCM-L Technology

Robinson, Dale L., Clegg, David B.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 3.51 MB

english, 1995

30

Design of Epoxy Encapsulating Compounds for Highly Reliable Surface Mounting Semiconductor Devices

Ishii, Toshiaki, Moteki, R., Nagai, A., Eguchi, S., Ogata, M.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 402 KB

english, 1995

31

Mold Compounds: Linking Material Science and IC Package Reliability

Groothuis, Steven K., Heinen, K. Gail

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 2.23 MB

english, 1995

32

Siloxane Polymers as Low Dielectric Materials for Microelectronics

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 280 KB

english, 1995

33

Electronic Packaging Education in U.S.

Tummala, Rao R.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.05 MB

english, 1995

34

Viscoelastic Characterization of an Epoxy-Based Molding Compound

Kenner, V. H., Julian, M. R., Popelar, C. H., Chengalva, M. K.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 378 KB

english, 1995

35

Wetting Behaviors of Sn-Based Solders on Cu and Pd Surfaces

Kim, H. K., Wang, Y., Maheshwari, A., Tu, K. N.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 2.41 MB

english, 1995

36

Spreading Kinetics of Molten 60Sn40Pb on Higher Melting Temperature Pb-Sn Alloy Substrates

Conrad, H., Guo, Z., Jung, D. Y.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 1.27 MB

english, 1995