Reliability investigations on LIFT-printed isotropic...

Microelectronics Reliability 2015 / 11 Vol. 55; Iss. 11

Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications

Sridhar, Ashok, Perinchery, Sandeep M., Smits, Edsger C.P., Mandamparambil, Rajesh, van den Brand, Jeroen
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Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.07.006
Date:
November, 2015
File:
PDF, 1.13 MB
english, 2015
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