Using RBF networks for detection and prediction of flip chip with missing bumps
Liao, Guanglan, Du, Li, Su, Lei, Zeng, Miao, Nie, Lei, Shi, TielinVolume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2015.09.030
Date:
December, 2015
File:
PDF, 2.28 MB
english, 2015