Failure analysis of epoxy molded IC packages

Microelectronics International 2016 / 05 Vol. 33; Iss. 2

Failure analysis of epoxy molded IC packages

Janeczek, Kamil, Arazna, Aneta, Futera, Konrad, Koziol, Grazyna
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Volume:
33
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/MI-07-2015-0063
Date:
May, 2016
File:
PDF, 658 KB
english, 2016
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