Volume 33; Issue 2

Microelectronics International

Volume 33; Issue 2

1

Failure analysis of epoxy molded IC packages

Janeczek, Kamil, Arazna, Aneta, Futera, Konrad, Koziol, Grazyna

Journal:

Microelectronics International

Year:

2016

Language:

english

File:

PDF, 658 KB

english, 2016

2

A simulation study of silver nanowire for water and ethane vapor sensing

Refaat, Marjan, Moslemi, Mohammad Reza

Journal:

Microelectronics International

Year:

2016

Language:

english

File:

PDF, 403 KB

english, 2016

3

BiCMOS Colpitts oscillator for vector-sum interpolators

George, Deepa, Sinha, Saurabh

Journal:

Microelectronics International

Year:

2016

Language:

english

File:

PDF, 380 KB

english, 2016

4

Thermal shock and degradation of metallization systems on silicon

Skvortsov, Arkady, Zuev, Sergey, Koryachko, Marina, Glinskiy, Vadim

Journal:

Microelectronics International

Year:

2016

Language:

english

File:

PDF, 328 KB

english, 2016