Thermal properties of quantum devices in integrated circuits embedded in a chip environment
Käso, M., Wulf, U., Kuˇcera, J., Richter, H., Höntschel, J.Volume:
11
Language:
english
Journal:
physica status solidi (c)
DOI:
10.1002/pssc.201300203
Date:
January, 2014
File:
PDF, 171 KB
english, 2014