Optimal design analysis for thermal performance of high...

Journal of Semiconductors 2016 / 03 Vol. 37; Iss. 3

Optimal design analysis for thermal performance of high power 2.5D package

Liu, Xiaoyang, Ma, He, Yu, Daquan, Chen, Wenlu, Wu, Xiaolong
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Volume:
37
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/37/3/035006
Date:
March, 2016
File:
PDF, 803 KB
english, 2016
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