Delamination and solder flow‐out in underfilled and Pb‐free flip chips on laminate
van Kleef, Marc, Bielen, Jeroen, Gülpen, Jan, Ramos, MikeVolume:
22
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/13565360510593710
Date:
August, 2005
File:
PDF, 396 KB
english, 2005