Volume 22; Issue 2

Microelectronics International

Volume 22; Issue 2
2

Chip packaging challenges … a roadmap based overview

Longford, Andy
Journal:
Microelectronics International
Year:
2005
Language:
english
File:
PDF, 398 KB
english, 2005
4

A faster power MOSFET device with electrical stress treatment

Salame, C., Habchi, R., Tazibt, W., Khoury, A., Mialhe, P.
Journal:
Microelectronics International
Year:
2005
Language:
english
File:
PDF, 224 KB
english, 2005
7

Reliability assessment for SnPb solder and Ag‐Pd bond pad metallization

Choon Teo, Kiat, Lin Ting, Yu
Journal:
Microelectronics International
Year:
2005
Language:
english
File:
PDF, 668 KB
english, 2005