Reliability assessment for SnPb solder and Ag‐Pd bond pad...

Reliability assessment for SnPb solder and Ag‐Pd bond pad metallization

Choon Teo, Kiat, Lin Ting, Yu
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Volume:
22
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/13565360510592199
Date:
August, 2005
File:
PDF, 668 KB
english, 2005
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