Reliability of tin‐lead balled BGAs soldered with lead‐free...

Soldering & Surface Mount Technology 2002 / 08 Vol. 14; Iss. 2

Reliability of tin‐lead balled BGAs soldered with lead‐free solder paste

Tapani Nurmi, Sami, Olavi Ristolainen, Eero
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Volume:
14
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910210427808
Date:
August, 2002
File:
PDF, 377 KB
english, 2002
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