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Researching the silicon direct wafer bonding with interfacial SiO 2 layer
Wang, Xiaoqing, Yu, Yude, Ning, JinVolume:
37
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/37/5/056001
Date:
May, 2016
File:
PDF, 1.68 MB
english, 2016