High‐resolution integration of passives using micro‐contact...

Microelectronics International 2003 / 04 Vol. 20; Iss. 1

High‐resolution integration of passives using micro‐contact printing (μCP)

Lakeman, Charles D.E., Fleig, Patrick F.
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Volume:
20
Language:
english
Journal:
Microelectronics International
DOI:
10.1108/13565360310455544
Date:
April, 2003
File:
PDF, 649 KB
english, 2003
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