Volume 20; Issue 1

Microelectronics International

Volume 20; Issue 1

1

Measurements and simulation of SMT components

Pryputniewicz, Ryszard J., Rosato, David, Furlong, Cosme

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 218 KB

english, 2003

2

Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices

Lalinsky´, T., Haščík, Sˇ., Mozolová, Ž., Burian, E., Krnáč, M., Tomáška, M., Škriniarová, J., Drzˇík, M., Kosticˇ, I., Matay, L.

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 246 KB

english, 2003

3

Multi‐layer thick‐film microwave components and measurements

Tian, Zhengrong, Free, Charles, Aitchison, Colin, Barnwell, Peter, Wood, James

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 343 KB

english, 2003

4

A frequency tunable half‐wave resonator using a MEMS variable capacitor

Bell, Patrick, Hoivik, Nils, Bright, Victor, Popovic, Zoya

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 297 KB

english, 2003

5

Materials characterization of the effect of mechanical bending on area array package interconnects

Rooney, Daniel T., Todd Castello, N., Cibulsky, Mike, Abbott, Doug, Xie, Dongji

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 579 KB

english, 2003

6

Advanced thick film system for AlN substrates

Wang, Y.L., Carroll, A.F., Smith, J.D., Cho, Y., Bacher, R.J., Anderson, D.K., Crumpton, J.C., Needes, C.R.S.

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 235 KB

english, 2003

7

An evaluation of materials and processes employed in the construction of novel thick film force sensors

Zheng, Yulan, Atkinson, John, Zhang, Zhige, Sion, Russ

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 184 KB

english, 2003

8

High‐resolution integration of passives using micro‐contact printing (μCP)

Lakeman, Charles D.E., Fleig, Patrick F.

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 649 KB

english, 2003

9

High‐ Q RF inductors on 20 Ω.cm silicon realized through wafer‐level packaging techniques

Carchon, G.J., De Raedt, W., Beyne, E.

Journal:

Microelectronics International

Year:

2003

Language:

english

File:

PDF, 583 KB

english, 2003