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A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects
Vianco, P.T., Rejent, J.A.Volume:
14
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910210427790
Date:
August, 2002
File:
PDF, 971 KB
english, 2002